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12 inch Olympus wafer inspection system
There are mainly two types of 12 inch Olympus wafer inspection systems, namely AL120-LMB12-LP and AL120-LMB12-F. The Olympus wafer inspection system c
Product details
The main features of the 12 inch Olympus wafer inspection system are:
● Sturdy, reliable, and safe transmission
The 12 inch Olympus wafer inspection system continues the robustness, reliability, and safety of the previous generation model, capable of safely and reliably transporting 300mm wafers, as well as thin and Warped wafers.
● Ergonomic design, easy to operate
The 12 inch Olympus wafer inspection system has a freely adjustable inspection mode, and its design takes into account the operability in post-processing, with particular emphasis on the ease of equipment operation. Corresponding to two models of FOUP (Load Port) and FOSB respectively.
The optimization of macroscopic observation positions and centralized arrangement of operating units in the 12 inch Olympus wafer inspection system have improved the operability of the equipment.
Automatic 300mm wafer inspection system AL120-12 technical specifications
model |
AL120-LMB12-LP |
AL120-LMB12-F |
Wafer size |
300 mm (SEMI M1.15 t=775 μ m) optional: 200 mm |
|
Number of card boxes |
Single box (for both loading and unloading purposes) |
|
Card box height setting |
900 mm |
|
Loading port |
have |
not have |
Transportation sequence |
Surface macro, internal macro, and microscopic examination |
|
check mode |
All inspections, sampling inspections |
|
Wafer calibration |
Non contact center ring |
|
Wafer handling method |
Vacuum adsorption mechanical handling |
|
Applicable microscope |
Semiconductor Inspection Microscope MX61L |
|
application environment |
AC100～120 V，220～240 V，3.0/1.7 A，50/60 Hz ， Vacuum -67~-80 Kpa |
|
stage |
XY manual suction stage with XY coarse/fine adjustment and 360 degree rotation mechanism |
|
Weight (excluding microscope) |
About 360 kg |
About 270 kg |
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