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E07-400T10S SoC 贴片型无线模块
E07-400T10S SoC 贴片型无线模块
E07-400T10S SoC 贴片型无线模块
Product Introduction: E07-400T10S is a self-developed 410-450MHz patch wireless module based on the MSP430FR2433 and CC1101 produced by Texas Instrume

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Product details

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Parameters describe
 notes
Reference distance
 1.5km

Clear and open environment, maximum power, antenna gain 5dBi, height 2.5m, airspeed 1.2kbps
FIFO
 64Byte

Maximum length for a single transmission
crystal frequency
 26MHz

External crystal oscillator
Modulation Type
 GFSK (Recommended)

Supports OOK, ASK, GFSK, 2-FSK, 4-FSK, and MSK
Packaging method
 Surface mount stamp hole

Half hole, hole spacing 1.27mm
MCU
 MSP430FR2433

Texas Instruments
communication interface
 UART、SPI、ADC、GPIO

Users need to develop and set up their own settings
External dimensions
 14*26mm

-
antenna interface
 IPE/Stamp Hole

Equivalent impedance of approximately 50 ohms


Electrical parameters minimum value Typical values Maximum value unit condition
working voltage
 2.5 5.0 5.5
 V

≥ 5.0V can ensure output power; Module permanently burned out beyond 5.5V
Working frequency band
 410
 433
 450
 MHz
 Support ISM frequency band
Communication level - 3.3 - V use5V TTLThere is a risk of burning
Emission Current -
 35 - mA Instantaneous power consumption
Receiving Current - 18 - mA
 -
Sleep current - 0.6 - uA Software shutdown
operation temperature
 -40 -
 +85 ℃ Industrial grade
Maximum transmission power
 9.5 10 11 dBm
 -
receiver sensitivity
 -107
 -106 dBm
 -109
 dBm
 The air speed is 1.2kbps
air rate
 0.6k - 500k bps
 User programming control

E07(900T10S)官网_09


Serial Number
 Pin Pin direction notes
1 SWDIO input
 Program download/debugging port, please refer to the chip manual (MSP430FR2433)
2, 11, 13 ~17, 26
 GND
 （-）
 Ground wire, connected to the power reference ground
3 SWCLK input
 Program download/debugging port, please refer to the chip manual (MSP430FR2433)
4 3.3V input
 Program Download Power Supply 3.3V
5 P2.0/XOUT input/output
 For usage details, please refer to the chip manual (MSP430FR2433)
6 P2.1/XIN input/output
 For usage details, please refer to the chip manual (MSP430FR2433)
7 P1.4/UCA0TXD
 input/output
 For usage details, please refer to the chip manual (MSP430FR2433)
8 P1.5/UCA0RXD
 input/output
 For usage details, please refer to the chip manual (MSP430FR2433)
9 P1.6/UCA0CLK
 input/output
 For usage details, please refer to the chip manual (MSP430FR2433)
10 P1.7/UCA0STE input/output
 For usage details, please refer to the chip manual (MSP430FR2433)
18 P2.3 input/output
 For usage details, please refer to the chip manual (MSP430FR2433)
19 P3.1/UCA1STE input/output For usage details, please refer to the chip manual (MSP430FR2433)
20 P2.4/UCA1CLK input/output
 For usage details, please refer to the chip manual (MSP430FR2433)
21 P2.7 input/output
 For usage details, please refer to the chip manual (MSP430FR2433)
22
 P2.5/UCA0RXD
 input/output
 For usage details, please refer to the chip manual (MSP430FR2433)
23 P2.6/UCA0TXD
 input/output
 For usage details, please refer to the chip manual (MSP430FR2433)
24 P3.2
 input/output
 For usage details, please refer to the chip manual (MSP430FR2433)
25
 +5V
 input
 Module power input, available for (2.5V-5.5V) input
Note 1: Within the module, GDO0 and GDO2 of RF chip CC1101 have been connected to P3.0 and P2.2 of MCU chip MSP430FR2433, respectively. Please refer to Chapter 5 of the manual for details.
Product manual

Development testing




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product
model		 interface type Chip Solution Carrier frequency Hz Transmission power dBm Test distance in kilometers air rate
bps		 Packaging form Product size mm Product Features technology
manual		 sample
buy
SPI CC1101 868M 10 1.5 0.6k~500k Patch 14*26m Small size, capable of developing low power consumption
SPI CC1101 433M 10 1.5 0.6k~500k Patch 14*26m Small size, capable of developing low power consumption
USB - - - - - - 53*27mm E07-900M10S Development Evaluation Kit
USB - - - - - - 53*27mm E07-400M10S Development Evaluation Kit
SPI CC1101 868M 10 1.5 0.6k~500k Patch 14*20m Small size, capable of developing low power consumption
SPI CC1101 433M 20 2 0.6k~500k Patch 18 * 32 Small size, capable of developing low power consumption
SPI CC1101 433M 10 1.5 0.6k~500k Patch 14*20m Small size, capable of developing low power consumption
SPI CC1101 915M 10 1.2 0.6k~500k Patch 13 * 19 Small size, capable of developing low power consumption
SPI CC1101 868M 10 1.0 0.6k～500k Patch 13 * 19 Small size, capable of developing low power consumption
SPI CC1101 433M 10 0.5 0.6k~500k Direct insertion 15 * 30 High performance, capable of developing low power consumption
SPI CC1101 433M 10 0.6 0.6k~500k Direct insertion 15 * 30 High performance, capable of developing low power consumption
SPI CC1101 433M 10 0.4 0.6k~500k Patch 13 * 19 Small size, capable of developing low power consumption
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    Product model: E07-900T10S

    interface type

    :SPI

    Chip Solution

    :CC1101

    Carrier frequency Hz

    :868M

    Transmission power dBm

    :10

    Test distance in kilometers

    :1.5

    Air speed bps

  • :0.6k~500k

    Packaging form

    : Surface mount

    Product size mm

    :14*26m

    Product features: Small size, can be developed with low power consumption

    PDF ：

    buy

    E07-400T10S

    Product model: E07-400T10S

    interface type

    :SPI

    Chip Solution

  • :CC1101

    Carrier frequency Hz

    :433M

    Transmission power dBm

    :10

    Test distance in kilometers

    :1.5

    Air speed bps

    :0.6k~500k

    Packaging form

    : Surface mount

    Product size mm

    :14*26m

  • Product features: Small size, can be developed with low power consumption

    PDF ：

    buy

    E07-900MBL-01

    Product Model: E07-900MBL-01

    interface type

    :USB

    Chip Solution

    :-

    Carrier frequency Hz

    :-

    Transmission power dBm

    :-

  • Test distance in kilometers

    :-

    Air speed bps

    :-

    Packaging form

    :-

    Product size mm

    :53*27mm

    Product Features: E07-900M10S Development Evaluation Kit

    PDF ：

    buy

    E07-400MBL-01

    Product Model: E07-400MBL-01

  • interface type

    :USB

    Chip Solution

    :-

    Carrier frequency Hz

    :-

    Transmission power dBm

    :-

    Test distance in kilometers

    :-

    Air speed bps

    :-

    Packaging form

  • :-

    Product size mm

    :53*27mm

    Product Features: E07-400M10S Development Evaluation Kit

    PDF ：

    buy

    E07-900M10S

    Product model: E07-900M10S

    interface type

    :SPI

    Chip Solution

    :CC1101

    Carrier frequency Hz

  • :868M

    Transmission power dBm

    :10

    Test distance in kilometers

    :1.5

    Air speed bps

    :0.6k~500k

    Packaging form

    : Surface mount

    Product size mm

    :14*20m

    Product features: Small size, can be developed with low power consumption

    PDF ：

  • buy

    E07-433M20S

    Product model: E07-433M20S

    interface type

    :SPI

    Chip Solution

    :CC1101

    Carrier frequency Hz

    :433M

    Transmission power dBm

    :20

    Test distance in kilometers

    :2

  • Air speed bps

    :0.6k~500k

    Packaging form

    : Surface mount

    Product size mm

    :18 * 32

    Product features: Small size, can be developed with low power consumption

    PDF ：

    buy

    E07-400M10S

    Product model: E07-400M10S

    interface type

    :SPI

  • Chip Solution

    :CC1101

    Carrier frequency Hz

    :433M

    Transmission power dBm

    :10

    Test distance in kilometers

    :1.5

    Air speed bps

    :0.6k~500k

    Packaging form

    : Surface mount

    Product size mm

  • :14*20m

    Product features: Small size, can be developed with low power consumption

    PDF ：

    buy

    E07-915MS10

    Product model: E07-915MS10

    interface type

    :SPI

    Chip Solution

    :CC1101

    Carrier frequency Hz

    :915M

    Transmission power dBm

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