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Ion grinder ArBlade 5000
ArBlade 5000 is a high-performance model of Hitachi ion grinder. It achieves ultra high speed section grinding. The high-efficiency cross-sectional pr
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Ion grinder ArBlade 5000

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离子研磨仪 ArBlade 5000

ArBlade 5000 is a high-performance model of Hitachi ion grinder.
It achieves ultra high speed section grinding.
The high-efficiency cross-sectional processing function makes sample processing easier during electron microscopy cross-sectional observation.

  • characteristic

  • Specifications

characteristic

The cross-sectional grinding rate can reach up to 1 mm/h*1

The newly developed PLUSII ion gun emits a high current density ion beam, significantly improving*2The grinding rate.

*1
Si protruding shield edge of 100 µ m, maximum processing depth in 1 hour
*2
The grinding rate is twice that of our company's product (IM4000PLUS: 2014 production)

Comparison of cross-sectional grinding results
(Sample: Automatic pencil lead, grinding time: 1.5 hours)

本公司产品IM4000PLUS
Our company's product IM4000PLUS

ArBlade 5000
ArBlade 5000

The maximum cross-sectional grinding width can reach 8 mm!

Using a wide cross-sectional grinding sample holder, the processing width can reach 8 mm, which is very suitable for grinding electronic components and other materials.

Composite grinder

The IM4000 series composite (cross-sectional grinding, planar grinding) ion grinder has been widely praised.
Samples can be pre processed according to requirements.

Section grinding

Cross section production of soft materials or composite materials that are difficult to handle by cutting or mechanical grinding

plane lapping

Refinement or surface cleaning of samples after mechanical grinding

截面研磨加工示意图
Schematic diagram of sectional grinding processing

平面研磨加工示意图
Schematic diagram of flat grinding processing

specifications

specifications
general
Using Gas Ar gas
Accelerating Voltage 0~8 kV
Section grinding
Fastest grinding rate (material Si) 1 mm/hr*1Above includes 1 mm/hr*1
Maximum grinding width 8 mm*2
Maximum sample size 20(W) × 12(D) × 7(H) mm
Sample movement range X ± 7 mm, Y 0~+3 mm
Intermittent processing function of ion beam Standard configuration
Swing angle ± 15 °, ± 30 °, ± 40 °
Flat grinding
Maximum processing range φ32 mm
Maximum sample size φ50 × 25(H) mm
Sample movement range X 0~+5 mm
Intermittent processing function of ion beam Standard configuration
rotational speed 1 r/m、25 r/m
Tilt angle 0~90°
*1
Si protruding shield edge of 100 µ m, maximum processing depth in 1 hour
*2
When using a wide cross-section grinding sample holder

Optional

specifications
project content
High wear-resistant shielding plate The wear-resistant shielding plate is about twice that of the standard shielding plate (excluding cobalt)
Processing monitoring microscope Magnification ratio of 15 ×~100 × for binocular and trinocular models (CCD can be added)

Related product classification

  • Field emission scanning electron microscope (FE-SEM)
  • Scanning Electron Microscope (SEM)
  • Transmission Electron Microscopy (TEM/STEM)
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