Electronic component X-ray testing station
XT V 130

Compact design, convenient functionality, multifunctional small electronic component quality assurance testing system

For the high-tech electronic components that are gradually appearing, surface testing can no longer meet the testing requirements of current customers. Due to the inability to directly observe short circuits and open circuits in internal electronic circuits, high-performance real-time X-ray detection is crucial and effective. The XTV130 X-ray inspection system, specially developed for BGA inspection and multi-layer PCB soldering inspection, makes defect detection and analysis of PCB circuit boards more rapid and flexible. The Inspect-X software configured in it enables automatic detection and automatic identification of circuit boards (optional) to achieve efficient detection and processing capabilities.

Main Features

A specially designed micro focus gun source with a focal size of 3 microns
16 bit color depth high-resolution images and image processing tools
A large tray that can hold multiple sample circuit boards simultaneously
Observation at a maximum tilt angle of 60 °
• Rotating sample tray (360 ° continuous rotation) (optional)

Up to 320 times magnification of the observation area of interest
Flexible observation with a maximum tilt of 60 ° can identify issues at the three-dimensional connection

Introduction of functions

X-ray workstation for quality assurance testing of electronic components
Macro based automation functions that do not require special programming techniques
Automatic determination of the qualification of part characteristics, offline visual inspection, and report generation
Based on VBA, complex processes can be simplified and automated
Multi axis directional control lever makes online navigation more intuitive
X-ray open tube technology makes maintenance costs more affordable
A radiation measurement safety system that does not require additional protective measures
• Small footprint, light weight, easy installation and setup

purpose

BGA defect detection
Electronic components, circuit components
• Gold wire pin connection fault points, spherical virtual solder joints, gold wire curvature, chip bonding, dry bonding, bridging/short circuiting, internal bubbles, BGA, etc
• Pre assembly/post assembly PCB
Position deviation of parts, display of defects such as weld gaps, bridging, surface assembly, etc
Through hole coating, detailed inspection of multi-layer arrangement
Wafer level chip scale packaging (WLCSP)
BGA and CSP testing
Non lead soldering inspection
Micro electromechanical systems (MEMS), micro electromechanical systems (MOEMS)
• Cables, connectors, plastic parts, etc