YAMAHA high-end hybrid optical appearance inspection device YSi-V
characteristic:

① 2D high-speed, high-resolution 2D inspection

High resolution imaging with 12 million pixels
The industry is the first to adopt a 12 megapixel camera and a high pixel telephoto lens. Equipped with a high-speed image processing control system, it not only expands the field of view, but also has high-definition and high-speed capabilities, with inspection capabilities more than twice as high as before
5 different methods can be selected to achieve optimal inspection (brightness, chromaticity, slope, infrared, laser)
② 3D height and inclined surface 3D inspection (optional)
● High speed measurement of the entire field of view at once. For defects that are difficult to detect in 2D drawings due to the color similarity between components, substrates, or interference from silk screen printing and solder pads, they can also be accurately detected. In addition, the inclination and direction of the object can be checked to accurately determine whether the shape is correct
③ 4D 4-Direction Strabismus Camera (Optional)
In addition to taking 2D inspection images from directly above, a unique camera technology is also used to capture all components in the wrong position and field of view from four directions in a single oblique direction, accurately tracking the components. Based on images taken from four directions, it is possible to visually inspect the substrate without removing it, thereby preventing human errors caused by touching the substrate and reducing the number of processes
④ Support QA optional software and smartphone judgment (optional)
● Smartphone judgment
Send the detected defective information to the operator's smartphone through wireless LAN network, which can be remotely judged through the smartphone
● QA optional software
After detecting defects, automatic feedback is provided through the LAN network. Forcefully stop the operation of the object placement machine and display information related to different component installation positions, placement heads, nozzle types, etc. on the screen of the placement machine
⑤ The use of a dual track system allows for parallel transmission of two columns, improving the inspection speed of small and medium-sized substrates; It can also transport large ultra long substrates up to L750mm (optional)
If you need to transfer substrates with a length exceeding L750mm, please contact us

Basic specifications and parameters

1. Model: Yamaha YSi-V
2. Object substrate: L610 x W560 (maximum)~L50 x W50 (minimum)&supports L750mm ultra long substrate (optional)
3. Resolution: Visible light (red/green/blue)&Infrared (Infrared Red) 12 μ m/7 μ m (optional)
4. Inspection object: The condition of the component immediately after installation, the cured solder paste, and the condition of the component
5. Power specifications: three-phase 200/208/220/230/240/400/416V, ± 10% 50/60Hz
6. Supply gas source: above 0.4MPa, in a clean and dry state
7. Dimensions (excluding protruding parts): L1252mm x W1497mm x H1550mm
8. Main body weight: approximately 1300kg